Bergquist Company

Henkel’s acquisition of The Bergquist Company in 2014 effectively expanded Henkel’s leading position in electronic materials development to include state-of-the-art thermal control products. Henkel’s BERGQUIST GAP PAD® gap filling thermal interface materials (TIMs) are soft, compliant, pre-cut pads that reduce assembly stress while providing excellent thermal conductivity. Liquid BERGQUIST Gap Filler TIMs, which can be automatically dispensed, are ideal for applications where complex dimensions are the norm and/or high throughput is required. The expansive thermal solutions portfolio also includes SIL PAD® thermally conductive insulators, BOND PLY® thermal adhesives, HI FLOW® phase change materials and TCLAD® Insulated Metal Substrates (IMS®).

Výrobky, které nabízí Bergquist Company

Liqui-Form TLF 10000 10W/m-K Thermal Gel

Liqui-Form TLF 10000 10W/m-K Thermal Gel

Assures high thermal conductivity, good dispensing efficiency, and high thermal reliability.

EV Charging Solutions

EV Charging Solutions

Designed to provide safe charging while protecting EV battery packs from thermal/electrical events.

TGF 4500CVO 4.5W/m-K High Dispense Rate Gap Filler

TGF 4500CVO 4.5W/m-K High Dispense Rate Gap Filler

High dispense rate, thermally conductive liquid gap fillers that use 2K silicone technology.

TGF 3000SF 3.0W/m-K, Sil-Free Gap Filler

TGF 3000SF 3.0W/m-K, Sil-Free Gap Filler

Two-part, silicone-free liquid TIM gap filler that provides thermal conductivity of 3.0W/m-K.