BECOM
BECOM Systems develops innovative sensor solutions, including time-of-flight 3D cameras and a variety of system-on-module solutions.
Výrobky, které nabízí BECOM
CM-BF537 Core Module
Offers broad field of application & configuration possibilities, based on Analog Devices ADSP-BF537.
TCM-BF537 Tiny Core Module
Ideal for industrial temp range & volume production, powered by Analog Devices Blackfin® Processor.
eCM-BF561 Core Module with ADSP-BF561 Blackfin®
Optimized for performance & parallel data processing, powered by Analog Devices.