176-Layer NAND Universal Flash Storage (UFS) 3.1

Micron 176-Layer NAND Universal Flash Storage (UFS) 3.1 is a lighting-fast Flash memory solution based on 3D Replacement Gate technology, optimized for high-end and flagship phones. The 175-layer UFS 3.1 unlocks 5G's potential with up to 75% faster sequential write and random read performance than the prior 96-layer generation, enabling downloads of two-hour 4K movies in as little as 9.6s. Micron 176-layer UFS 3.1 features a compact design ideal for the high capacity, small form factors required in mobile devices. Micron 176-layer NAND UFS 3.1 is offered in 128GB, 256GB, 512GB, 1TB, and 2TB capacities.