DA14706-00000HZ2

Renesas / Dialog
724-DA14706-00000HZ2
DA14706-00000HZ2

Mfr.:

Description:
RF System on a Chip - SoC Multi-core wireless MCU for Bluetooth 5.2 and proprietary 2G4 protocols

Datasheet:
ECAD Model:
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Learn more about Renesas / Dialog DA14706-00000HZ2

In Stock: 3 206

Stock:
3 206 Can Dispatch Immediately
Factory Lead Time:
18 Weeks Estimated factory production time for quantities greater than shown.
Quantities greater than 3206 will be subject to minimum order requirements.
Minimum: 1   Multiples: 1
Unit Price:
-,-- Kč
Ext. Price:
-,-- Kč
Est. Tariff:
Packaging:
Full Reel (Order in multiples of 4000)

Pricing (CZK)

Qty. Unit Price
Ext. Price
Cut Tape / MouseReel™ †
281,30 Kč 281,30 Kč
233,04 Kč 2 330,40 Kč
217,52 Kč 5 438,00 Kč
198,85 Kč 19 885,00 Kč
188,91 Kč 47 227,50 Kč
183,33 Kč 91 665,00 Kč
179,94 Kč 179 940,00 Kč
Full Reel (Order in multiples of 4000)
179,94 Kč 719 760,00 Kč
† A MouseReel™ fee of 165,00 Kč will be added and calculated in your basket. All MouseReel™ orders are non-cancellable and non-returnable. ↩

Product Attribute Attribute Value Select Attribute
Renesas Electronics
Product Category: RF System on a Chip - SoC
RoHS:  
Bluetooth
ARM Cortex M33
2.4 GHz
6 Mbps
6 dBm
- 97 dBm
2.9 V
4.75 V
1.85 mA
3 mA
4 kB, 32 kB
- 40 C
+ 85 C
VFBGA-142
Reel
Cut Tape
MouseReel
Brand: Renesas / Dialog
Data RAM Size: 1.5 MB
Maximum Clock Frequency: 160 MHz, 2.4 GHz
Moisture Sensitive: Yes
Mounting Style: SMD/SMT
Number of I/Os: 79 I/O
Product Type: RF System on a Chip - SoC
Series: DA14706
Factory Pack Quantity: 4000
Subcategory: Wireless & RF Integrated Circuits
Technology: Si
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Attributes selected: 0

Datasheet

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CNHTS:
8542319092
USHTS:
8542310070
ECCN:
5A992.C

DA14706 Highly Integrated Advanced Wireless MCU

Renesas / Dialog DA14706 Highly Integrated Advanced Wireless MCU has integrated application processors, 2D Graphics processors, Voice Activity Detector (VAD), and Power Management Unit (PMU).  It's the only product in the BLUETOOTH® LE space to offer this level of integration. This allows for cost-effective and reliable form factor designs for complex sensor and graphical processing applications.

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