Všechny výsledky (1 094)

Počítačové moduly – COM COM Express Type 6 Compact module based on Intel Core i3-1320PRE

Počítačové moduly – COM JUMPtec COMe-bBD7R E2 D-1539 10G-KR

Vývojové desky a stavebnice – x86 EVALUATION CARRIER BRD FOR QSEVEN 2.0

Vývojové desky a soupravy - ARM SMARC Evaluation Carrier 2.0

Počítačové moduly – COM COM Express Type 6 Compact module with Intel Core i3-7100U dual core processor with 2.4GHz, 3MB Intel Smart Cache , GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U).

Počítačové moduly – COM COM Express Type 6 Basic module based on AMD embedded R-Series R1606G 2-core processor with 2.6 GHz up to 3.5 GHz turbo boost, 1MB L2 Cache and dual channel DDR4 2400MT/s memory interface (formerly Great Horned Owl). Features AMD Radeon Vega integr

Chladiče procesorů a čipů COMe Active Uni Cooler (w/o HSP)

Počítačové moduly – COM JUMPtec COMe mini Passive Uni Cooler (w/o HSP)

Počítačové moduly – COM COM Express Type 6 Compact module based on Intel Core i7-8665UE 4-core processor with 1.7GHz up to 4.4GHz turbo boost, 8MB L2 cache, Intel UHD Graphics 620 and dual channel DDR4 2400 MT/s memory interface (formerly Whiskey Lake).

Počítačové moduly – COM SMARC 2.0 module with advanced low-power 14nm NXP i.MX 8M Mini Quad processor. Features 4x ARM Cortex-A53 @1.8GHz and 1x ARM Cortex-M4, 2GB onboard LPDDR4 memory and 16GB onboard eMMC. Commercial temperature range.

Chladiče procesorů a čipů Passive cooling solution for SMARC module conga-SMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole.

Chladiče Standard Heatspreader for SMARC 2.0 module conga-SA5* For modules with IHS Intel Atom CPU* All stand-offs are bore hole 2.7mm