Infineon Technologies EasyPACK™ TRENCHSTOP™ IGBT7 Modules
Infineon Technologies EasyPACK™ TRENCHSTOP™ IGBT7 Modules are based on the latest micro-pattern trenches technology. This provides reduced losses and offers a high level of controllability. The chip is specially optimized for industrial drives applications. The modules offer lower static losses, higher power density and softer switching. A significant increase of power density can be obtained by raising the allowed maximum operation temperature up to 175°C in the power module.
Features
- LowVCEsat
- Trenchstop IGBT7
- Overload operation up to +175°C
- High power density
- Compact design
- Press-fit contact technology
Applications
- Auxiliary inverters
- Air conditioning
- Motor drives
- Servo drives
- Uninterruptible Power Supply (UPS) systems
Additional Resources
Zveřejněno: 2020-03-10
| Aktualizováno: 2022-12-23