congatec Embedded Solutions

Computer-On-Modules - COM COM Express Type 6 Compact module with Intel Core i3-7100U dual core processor with 2.4GHz, 3MB Intel Smart Cache , GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U).

Computer-On-Modules - COM JUMPtec COMe-bBD7R E2 D-1539 10G-KR

Computer-On-Modules - COM QSEVEN INTEL ATOM E3845 BAY TRAIL

Computer-On-Modules - COM Qseven 2.0 module based on Intel Atom x7 E3950 SoC (Itemp Quad-core, 12W TDP, CPU freq. 1.6/2.0GHz, GPU 18EU freq. 500/650MHz) with on-board memory 8GB DDR3L-1866 and 32GB eMMC.

Development Boards & Kits - ARM SMARC Evaluation Carrier 2.0

Development Boards & Kits - ARM 3.5 Carrier Board for SMARC 2.0 modules with ARMDimensions are 146mm x 102 mm (5.74" x 4.02")Operating Temperature: 0 C to 60 C (commercial)

Computer-On-Modules - COM COM-HPC client module based on Intel Xeon Processor W-11865MLE 8-core processor with 1.5GHz up to 4.5GHz turbo boost, 24MB Intel Smart Cache, Intel UHD Graphics and dual channel DDR4 3200 MT/s memory interface (formerly Tiger Lake-H) with Chipset

Computer-On-Modules - COM JUMPtec COMe-mAL10 E2 E3950 8E

Computer-On-Modules - COM JUMPtec COMe Eval Carrier2 T6 5mm

Computer-On-Modules - COM JUMPtec COMe-bKL6 i3-7102E CM238

Computer-On-Modules - COM Qseven module with Intel Atom E3845 quad core processor with 1.91GHz, 2MB L2 cache, 4GB 1333MT/s DDR3L onboard dual channel memory. No onboard eMMC.

Computer-On-Modules - COM COM Express Compact module with Intel Atom x5-E3940 quad core processor with 1.6GHz core frequency up to 1.8GHz, 2MB L2 cache and up to 8GB 1866MT/s DDR3L SODIMM memory support. Industrial grade temperature range from -40 C to 85 C.